LAP-100X Semi-automatic metallographic polishing machine
Main features:
1. Place three samples at the same time, and the samples swing from side to side to realize semi-automatic grinding and polishing;
2. The downward pressure of a single sample can be customized
3. Speed, grinding time, rotation direction, water valve closing and other grinding parameters, and automatically save, easy to call;
4. Four-gear manual mode, eight sets of automatic mode;
5. Parameters of each mode are set by the user; Grinding and polishing each step can be set stepless speed regulation;
6. The position of the drop can be adjusted by rotation, the water flow can be adjusted, the grinding start and end, the water automatically open and close;
7. Touch screen interface, easy to set grinding parameters, intuitive state display, simple operation;
8. Stable operation and low noise of the equipment;
9. Can connect and control the polishing liquid droplets (option).
Technical parameters:
Name specification
Sample oscillating frequency 9 times/min
Single sample down pressure 300g (customizable and changeable)
Diameter of working disk (mm) φ254 (optional φ203/φ230, φ304 can be customized)
The rotation speed of 100-1000r/min can be switched between positive and negative rotation
Four-gear manual V1=300r/min, V2=500r/min, V3=600r/min, V4=800r/min (User can change)
Eight-stage auto can be programmed with eight-stage speed, running time and wheel steering switch.
Motor power is 0.75kw
Power supply voltage: AC220V frequency: 50HZ
Overall dimensions (mm) 670 x 470 x 360 (L * W * H)
Weight 35kg
